On the Spatial Stability and Bifurcation of the Kirkendall Plane during Solid-State Interdiffusion-Reference-Cited by-同舟云学术

On the Spatial Stability and Bifurcation of the Kirkendall Plane during Solid-State Interdiffusion

Published:2008-11-11 Issue:3-4 Volume:33 Page:210-233
ISSN:1040-8436
Container-title:Critical Reviews in Solid State and Materials Sciences
language:en
Short-container-title:Critical Reviews in Solid State and Materials Sciences

Author:

Kodentsov A. A.,Paul A.,van Dal M. J. H.,Cserháti Cs.,Gusak A. M.,van Loo F. J. J.

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering,Physical and Theoretical Chemistry,Condensed Matter Physics,General Chemical Engineering,Electronic, Optical and Magnetic Materials

Link

http://www.tandfonline.com/doi/pdf/10.1080/10408430802462958

Reference75 articles.

1. Interface chemistry in aluminium alloy castings reinforced with iron base inserts

2. Interfacial structure of metal-ceramic joints.

3. Ni–Al composite coatings: diffusion analysis and coating lifetime estimation

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