THERMAL STRESSES IN A ONE-SIDED BONDED REPAIR BY A PLATE INCLUSION MODEL
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1080/713855937
Reference11 articles.
1. GEOMETRICALLY LINEAR ANALYSIS OF THE THERMAL STRESSES IN ONE-SIDED COMPOSITE REPAIRS
2. An analytical estimate of thermal effects in a composite bonded repair: plane stress analysis
3. Eshelby's inclusion problem for polygons and polyhedra
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