An analytical estimate of thermal effects in a composite bonded repair: plane stress analysis
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation
Reference12 articles.
1. The elastic field of an elliptic cylindrical inclusion in a laminate with multiple isotropic layers;Beom;Journal of Applied Mechanics,1999
2. Time- or cycle dependent crack bridging;Cox;Mechanics of Materials,1994
3. An approximate algorithmic solution for the elastic fields in bonded patched sheets;Duong;International Journal of Solids and Structures,2001
4. The stress intensity factor for a cracked stiffened sheet repaired with an adhesively bonded composite patch;Duong;International Journal of Fracture,1997
5. A nonlinear thermoviscoelastic stress and fracture analysis of an adhesive bond;Duong;Journal of Mechanics and Physics of Solids,1995
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