The method of images in thermoelasticity with an application to wafer heating-Reference-Cited by-同舟云学术

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The method of images in thermoelasticity with an application to wafer heating

Published:2021-07-07 Issue:8 Volume:44 Page:970-1010
ISSN:0149-5739
Container-title:Journal of Thermal Stresses
language:en
Short-container-title:Journal of Thermal Stresses

Author:

Veldman Daniel W. M.¹^ORCID,Fey Rob H. B.¹^ORCID,Zwart Hans¹²^ORCID,van de Wal Marc M. J.³,van den Boom Joris D. B. J.⁴,Nijmeijer Henk¹^ORCID

Affiliation:

1. Department of Mechanical Engineering, Eindhoven University of Technology, Eindhoven, the Netherlands

2. Department of Applied Mathematics, University of Twente, Enschede, the Netherlands

3. ASML Research, ASML, Veldhoven, the Netherlands

4. ASML D&E Machine Conditioning, ASML, Veldhoven, the Netherlands

Funder

the Impuls II research program of the High Tech System Center (HTSC) at the Eindhoven University of Technology

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/01495739.2021.1936321

Reference30 articles.

1. Partial Differential Equations

2. Analytical solutions of the thermal field induced by moving double-ellipsoidal and double-elliptical heat sources in a semi-infinite body

3. Semi-analytical solutions for the transient temperature fields induced by a moving heat source in an orthogonal domain

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1. Optimal thermal actuation for mirror temperature control;Computer Methods in Applied Mechanics and Engineering;2022-08

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