Thermomagnetic Convection in Square and Shallow Enclosures for Electronics Cooling
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,Numerical Analysis
Link
http://www.tandfonline.com/doi/pdf/10.1080/10407780902925440
Reference30 articles.
1. An optimal parametric design to improve chip cooling
2. Theoretical and experimental characterization of heat dissipation in a board-level microelectronic component
3. Quantification of chaotic strength and mixing in a micro fluidic system
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