Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index-Reference-Cited by-同舟云学术

Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index

Published:2016-06-17 Issue:24 Volume:30 Page:2699-2709
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Pan Kexue¹,Zeng Xingrong¹,Li Hongqiang¹,Lai Xuejun¹,Chen Zhonghua¹,Liang Guangqiang²

Affiliation:

1. College of Materials Science and Engineering, South China University of Technology, Guangzhou, People’s Republic of China

2. GuangDong Sheensun Technology Co., Ltd., Foshan, People’s Republic of China

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Open Research Funds of Guangdong Key Laboratory of High Performance and Functional Polymer Materials

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/01694243.2016.1197091

Reference30 articles.

1. Multifunctional Graphene Sheets Embedded in Silicone Encapsulant for Superior Performance of Light-Emitting Diodes

2. An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant

3. High refractive index thermally stable phenoxyphenyl and phenylthiophenyl silicones for light-emitting diode applications

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