An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant
Author:
Publisher
MDPI AG
Subject
General Materials Science
Link
http://www.mdpi.com/1996-1944/7/6/4088/pdf
Reference22 articles.
1. Effect of cure cycle on curing process and hardness for epoxy resin
2. Process Modeling of Composite Materials: Residual Stress Development during Cure. Part I. Model Formulation
3. Process Modeling of Composite Materials: Residual Stress Development during Cure. Part II. Experimental Validation
4. Residual stress development during processing of graphite/epoxy composites
5. Process induced stress and deformation in thick-section thermoset composite laminates;Bogetti;J. Compos. Mater.,1992
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