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Reliable thin chip peeling from adhesive tape with inverted needle ejecting and spring buffering

  • Published:2017-10-05 Issue:7 Volume:32 Page:753-771
  • ISSN:0169-4243
  • Container-title:Journal of Adhesion Science and Technology
  • language:en
  • Short-container-title:Journal of Adhesion Science and Technology

Author:

Hong Jinhua1,Chen Jiankui1ORCID,Xu Zhoulong1,Yin Zhouping1

Affiliation:

1. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, China

Funder

National Natural Science Foundation of China

National Natural Science Foundation of China (CN)

National Science and Technology Support Program

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Anti-Overturning Mechanism and Control Strategy In High-Speed Die Peeling-off Process;Proceedings of the 2023 6th International Conference on Robot Systems and Applications;2023-09-22

2. Flexible electronics manufacturing technology and equipment;Science China Technological Sciences;2022-08-15

3. Theoretical and experimental studies of spring-buffer chip peeling technology for electronics packaging;International Journal of Fracture;2022-05-16

4. Theoretical Modeling and Experimental Studies of Ultra-Thin Chip Transfer in Laser-Induced Forward Transfer;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-03
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