Theoretical and experimental studies of spring-buffer chip peeling technology for electronics packaging
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanics of Materials,Modeling and Simulation,Computational Mechanics
Link
https://link.springer.com/content/pdf/10.1007/s10704-022-00637-z.pdf
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4. Burghartz JN et al (2019) Hybrid systems-in-foil—combining the merits of thin chips and of large-area electronics. IEEE J Electron Devices Soc. https://doi.org/10.1109/JEDS.2019.2896188
5. Cheng TH, Tseng CH, Hung CH (2006) Analysis of stresses in adhesive joints applicable to IC chips using symbolic manipulation and the numerical method. J Adhes Sci Technol. https://doi.org/10.1163/156856106779024463
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