Preparation and adhesion performance of multilayered Ni coatings deposited by ultrasonic-assisted electroplating-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Preparation and adhesion performance of multilayered Ni coatings deposited by ultrasonic-assisted electroplating

Published:2013-01 Issue:2 Volume:27 Page:136-142
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Yu Zhiming,Zhu Yongkui,Niu Yunsong,Yang Ying,Wei Jie,Ding Wenjiang

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference17 articles.

1. Microstructure and properties of mechanical attrition enhanced electroless Ni–P plating on magnesium alloy

2. Adhesion improvements of Thermal Barrier Coatings with HVOF thermally sprayed bond coats

3. Key improvements in the machining of difficult-to-cut aerospace superalloys

4. Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings

5. Interfacial Stresses in Plated Beams with Exponentially-Varying Properties

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Relationship between flash temperature and wear characteristics in Ni-nano Al2O3 coating;Journal of Adhesion Science and Technology;2021-12-13

2. Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation;Nauka, bezbednost, policija;2019

3. Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation;Zastita materijala;2018

4. Beyond Conventional Patterns: New Electrochemical Lithography with High Precision for Patterned Film Materials and Wearable Sensors;Analytical Chemistry;2017-02-07

5. Influence of initial current density on bonding strength between Ni layer and Cu substrate in microelectroforming;Journal of Adhesion Science and Technology;2016-04-18

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3