Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation-Reference-Cited by-同舟云学术

Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation

Published:2019 Issue:1 Volume:24 Page:17-29
ISSN:0354-8872
Container-title:Nauka, bezbednost, policija
language:en
Short-container-title:Nauka bezbednost policija

Author:

Lamovec Jelena^ORCID,Jović Vesna^ORCID,Jaćimovski Stevo,Jovanov Goran,Radojević Vesna,Šetrajčić Jovan

Funder

Ministry of Education, Science and Technological Development of the Republic of Serbia

Publisher

Centre for Evaluation in Education and Science (CEON/CEES)

Subject

General Medicine

Link

https://scindeks-clanci.ceon.rs/data/pdf/0354-8872/2019/0354-88721901017L.pdf

Reference20 articles.

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2. Chen, M., Gao, J. (2000). The adhesion of copper films coated on silicon and glass substrates, Modern Physics Letters B, 14(3): 103-108. https://doi.org/10.1142/S0217984900000161;

3. Chicot, D., Lesage, J. (1995). Absolute hardness of films and coating, Thin Solid Films 254: 123-130. https://doi.org/10.1016/0040-6090(94)06239-H;

4. Datta, M., Landolt, D. (2000). Fundamental aspects and applications of electrochemical microfabrication, Electrochimica Acta, 45: 2535-2558. https://doi.org/10.1016/S0013-4686(00)00350-9;

5. Ebrahimi, F., Bourne, G.R., Kelly, M.S., Matthews, T.E. (1999). Mechanical properties of nanocrystalline nickel produced by electrodeposition, Nanostructured materials, 11(3): 343-350. https://doi.org/10.1016/S0965-9773(99)00050-1;