Geometrical optimization of boron arsenide inserts embedded in a heat spreader to improve its cooling performance for three dimensional integrated circuits-Reference-Cited by-同舟云学术

Geometrical optimization of boron arsenide inserts embedded in a heat spreader to improve its cooling performance for three dimensional integrated circuits

Published:2021-07-21 Issue:8 Volume:80 Page:389-410
ISSN:1040-7782
Container-title:Numerical Heat Transfer, Part A: Applications
language:en
Short-container-title:Numerical Heat Transfer, Part A: Applications

Author:

Tavakoli Andisheh¹,Salimpour Mohammad Reza¹²,Vafai Kambiz¹

Affiliation:

1. Department of Mechanical Engineering, University of California, Riverside, USA

2. Department of Mechanical Engineering, Isfahan University of Technology, Iran

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,Numerical Analysis

Link

https://www.tandfonline.com/doi/pdf/10.1080/10407782.2021.1947626

Reference18 articles.

1. A three-dimensional stochastic wire-length distribution for variable separation of strata

2. Analysis of critical thermal issues in 3D integrated circuits

3. K. Banerjee, A. Amerasekera, G. Dixit, and C. Hu, “The effect of interconnect scaling and low-k dielectric on the thermal characteristics of the IC metal,” presented at the International Electron Devices Meeting. Technical Digest, San Francisco, CA, USA, pp. 65–68, 1996.

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A novel heat transfer characterization method for a thermal management scheme of 3D-IC chips;Measurement;2024-02

2. Heat transfer enhancement for 3D chip thermal simulation and prediction;Applied Thermal Engineering;2024-01

3. The Effect of Self-Rewetting Fluids and Surface Wettability Modification on the Thermal Performance of a Two-Phase Flat-Shaped Thermosyphon;ASME Journal of Heat and Mass Transfer;2022-12-20

4. Thermal Performance Optimization of the Three-Dimensional Integrated Circuits Employing the Integrated Chip-Size Double-Layer or Multi-Layer Microchannels;ASME Journal of Heat and Mass Transfer;2022-12-09

5. Optimization of the utilization of phase change materials in planar structures to control and optimize energy flux;International Communications in Heat and Mass Transfer;2022-12