Modal ranges of 400 - 1800 keV4He+ions in si measured via blistering

Author:

Anttila A.,Hirvonen J.,Hautala M.

Publisher

Informa UK Limited

Subject

General Engineering

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Semi-empirical calculations for the ranges of fast ions in silicon;Radiation Effects and Defects in Solids;2018-04-03

2. In situ observation of gas reemission and blister rupture during helium implantation in silicon;Applied Physics Letters;2008-02-04

3. SOI Materials and Devices;Handbook of Semiconductor Manufacturing Technology, Second Edition;2007-07-09

4. Silicon-on-insulator by the Smart Cut™ Process;Wafer Bonding;2004

5. The use of ion channeling and elastic recoil detection in determining the mechanism of cleavage in the ion-cut process;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2002-05

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