Thermal Stresses Around Two Collinear Interface Cracks between a Nonhomogeneous Bonding Layer and One of the Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux-Reference-Cited by-同舟云学术

Thermal Stresses Around Two Collinear Interface Cracks between a Nonhomogeneous Bonding Layer and One of the Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux

Published:2010-03-31 Issue:4 Volume:33 Page:387-411
ISSN:0149-5739
Container-title:Journal of Thermal Stresses
language:en
Short-container-title:Journal of Thermal Stresses

Author:

Itou Shouetsu

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1080/01495731003658903

Reference20 articles.

1. A Crack Between Dissimilar Media

2. The Interface Crack

3. On the Mechanical Modeling of the Interfacial Region in Bonded Half-Planes

4. An Axisymmetric Crack in Bonded Materials With a Nonhomogeneous Interfacial Zone Under Torsion

5. Axsiymmetric crack problem in bonded materials with a graded interfacial region

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