Polydimethylsiloxane-Epoxy Copolymer for Industrial Applications
Author:
Publisher
Informa UK Limited
Subject
Polymers and Plastics,General Chemical Engineering,Analytical Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/00914037.2011.641644
Reference43 articles.
1. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices
2. Chemistry and Technology of Epoxy Resins
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