MD simulation analysis of the anchoring behavior of injection-molded nanopits on polyphenylene sulfide/Cu interface
Author:
Affiliation:
1. School of Mechanical and Electrical Engineering, Nanchang University, Nanchang, PR China
2. School of QingHu, Nanchang University, Nanchang, PR China
Funder
National Natural Science Foundation of China
Natural Science Foundation of Jiangxi Province of China
Publisher
Informa UK Limited
Subject
Surfaces, Coatings and Films,General Physics and Astronomy,Ceramics and Composites
Link
https://www.tandfonline.com/doi/pdf/10.1080/09276440.2021.1949102
Reference37 articles.
1. Manufacturing multi-material articulated plastic products using in-mold assembly
2. Thermoplastic bonding to metals via injection molding for macro-composite manufacture
3. Iso- and variothermal injection compression moulding of polymer micro- and nanostructures for optical and medical applications
4. Experimental investigation of a new hybrid molding process to manufacture high-performance composites
5. The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecular dynamics simulation
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