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Frequency response analysis of CNT bundle interconnects

  • Published:2022-09-02 Issue: Volume: Page:1-10
  • ISSN:2168-1724
  • Container-title:International Journal of Electronics Letters
  • language:en
  • Short-container-title:International Journal of Electronics Letters

Author:

Shefali M.1ORCID,Fatima Kaleem2ORCID,Uma Sathyakam P.3ORCID

Affiliation:

1. Department of ECE, University College of Engineering, Osmania University, Hyderabad, India

2. Department of ECE, Muffakham Jah College of Engineering & Technology, Hyderabad, India

3. School of Electrical Engineering, Vellore Institute of Technology, Vellore, India

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Instrumentation,Electronic, Optical and Magnetic Materials

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimal segmentation of Cu–CNT interconnects;Multiscale and Multidisciplinary Modeling, Experiments and Design;2024-04-10
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