Comparison between Grating Imaging and Transient Grating Techniques on Measuring Carrier Diffusion in Semiconductor-Reference-Cited by-同舟云学术

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Comparison between Grating Imaging and Transient Grating Techniques on Measuring Carrier Diffusion in Semiconductor

Published:2018-08-15 Issue:4 Volume:22 Page:348-359
ISSN:1556-7265
Container-title:Nanoscale and Microscale Thermophysical Engineering
language:en
Short-container-title:Nanoscale and Microscale Thermophysical Engineering

Author:

Chen Ke¹,Meng Xianghai¹,He Feng¹²,Zhou Yongjian¹,Jeong Jihoon¹^ORCID,Sheehan Nathanial³,Bank Seth R³,Wang Yaguo¹²

Affiliation:

1. Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, USA

2. Texas Materials Institute, The University of Texas at Austin, Austin, Texas, USA

3. Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas, USA

Funder

Army Research Laboratory

Division of Chemical, Bioengineering, Environmental, and Transport Systems

Division of Engineering Education and Centers

Small Business Innovative Research and Small Business Technology Transfer

Publisher

Informa UK Limited

Subject

Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Link

https://www.tandfonline.com/doi/pdf/10.1080/15567265.2018.1503382

Reference20 articles.

1. Transient Grating Studies of Carrier Diffusion and Mobility in Semiconductors

2. Spin Gratings and the Measurement of Electron Drift Mobility in Multiple Quantum Well Semiconductors

3. Ambipolar diffusion of photoexcited carriers in bulk GaAs

4. Ambipolar spin diffusion and D'yakonov-Perel' spin relaxation in GaAs quantum wells

5. Measurement of Ambipolar Diffusion Coefficient of Photoexcited Carriers with Ultrafast Reflective Grating-Imaging Technique

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1. Carrier Scattering at High Electric Fields;Semiconductor Physics;2023

2. Carrier Scattering at High Electric Fields;Semiconductor Physics;2022

3. Picosecond transient thermoreflectance for thermal conductivity characterization;Nanoscale and Microscale Thermophysical Engineering;2019-02-22

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