Simultaneous Evaluation of Heat Capacity and In-plane Thermal Conductivity of Nanocrystalline Diamond Thin Films-Reference-Cited by-同舟云学术

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Simultaneous Evaluation of Heat Capacity and In-plane Thermal Conductivity of Nanocrystalline Diamond Thin Films

Published:2021-10-02 Issue:3-4 Volume:25 Page:166-178
ISSN:1556-7265
Container-title:Nanoscale and Microscale Thermophysical Engineering
language:en
Short-container-title:Nanoscale and Microscale Thermophysical Engineering

Author:

Yates Luke¹,Cheng Zhe¹,Bai Tingyu²,Hobart Karl³,Tadjer Marko³,Feygelson Tatyana I³,Pate Bradford B.³,Goorsky Mark²,Graham Samuel¹^ORCID

Affiliation:

1. George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA

2. Materials Science and Engineering, University of California, Los Angeles, California, USA

3. High Power Electronics Branch, U.S. Naval Research Laboratory, Washington, DC, USA

Funder

Defense Advanced Research Projects Agency

NSF

Publisher

Informa UK Limited

Subject

Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Link

https://www.tandfonline.com/doi/pdf/10.1080/15567265.2021.2002484

Reference51 articles.

1. Thermal Conductivity of Diamond

2. Analysis and characterization of thermal transport in GaN HEMTs on Diamond substrates

3. Multilayer diamond heat spreaders for electronic power devices

4. Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices

5. Synthesis of diamonds by use of microwave plasma chemical-vapor deposition: Morphology and growth of diamond films

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1. Reduced temperature in lateral (AlxGa1−x)2O3/Ga2O3 heterojunction field effect transistor capped with nanocrystalline diamond;Applied Physics Letters;2024-04-08

2. Development of HFCVD apparatus for synthesizing diamond films with low thermal budget;Journal of Cleaner Production;2024-01

3. A review of thermal properties of CVD diamond films;Journal of Materials Science;2023-02

4. High thermal conductivity in wafer-scale cubic silicon carbide crystals;Nature Communications;2022-11-23

5. Through Plane Networked Graphene Oxide/Polyester Hybrid Thermal Interface Material for Heat Management Applications;Nanoscale and Microscale Thermophysical Engineering;2022-09-20

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