Cure Properties of Naphthalene-Based Epoxy Resin Systems with Hardeners and Latent Catalysts for Semiconductor Packaging Materials
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/15421406.2013.805071
Reference15 articles.
1. Cure properties of self-extinguishing epoxy resin systems with microencapsulated latent catalysts for halogen-free semiconductor packaging materials
2. Latent catalyst effects in halogen-free epoxy molding compounds for semiconductor encapsulation
3. Contributions of the network structure to the cure kinetics of epoxy resin systems according to the change of hardeners
4. Structural Effect on Thermal Cure and Property of Naphthalene-Based Epoxies: Preparation and Characterization
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