Latent catalyst effects in halogen-free epoxy molding compounds for semiconductor encapsulation
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference19 articles.
1. ; Polymer for Electronics; Mumindang: Seoul, Korea, 2001.
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4. Development of Biphenyl Epoxy Type Molding Compound for Surface Mount Devices.
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