Thermodynamic-RAM technology stack-Reference-Cited by-同舟云学术

Thermodynamic-RAM technology stack

Published:2017-04-18 Issue:4 Volume:33 Page:430-444
ISSN:1744-5760
Container-title:International Journal of Parallel, Emergent and Distributed Systems
language:en
Short-container-title:International Journal of Parallel, Emergent and Distributed Systems

Author:

Nugent M. Alexander¹,Molter Timothy W.¹

Affiliation:

1. Knowm Inc. , Santa Fe, NM, USA.

Funder

Air Force Research Labs

Publisher

Informa UK Limited

Subject

Computer Networks and Communications,Software

Link

Reference22 articles.

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Using Current to Drive Two SDC Memristors Connected in Series and in Anti-Series;2023 38th Conference on Design of Circuits and Integrated Systems (DCIS);2023-11-15

2. RevI-Ve: A Comprehensive Software Interface for Easy ReRAM Device Characterization;2023 12th International Conference on Modern Circuits and Systems Technologies (MOCAST);2023-06-28

3. Design and Simulation of Peripheral Driving Circuitry for Computational ReRAM;2022 37th Conference on Design of Circuits and Integrated Circuits (DCIS);2022-11-16

4. Reliability-Aware Ratioed Logic Operations for Energy-Efficient Computational ReRAM;2022 IFIP/IEEE 30th International Conference on Very Large Scale Integration (VLSI-SoC);2022-10-03

5. Stochastic Resonance Exploration in Current-driven ReRAM Devices;2022 IEEE 22nd International Conference on Nanotechnology (NANO);2022-07-04