Effects of wire deformation behaviour on bondability: Study of Cu wire stitch bonding (2nd Report)-Reference-Cited by-同舟云学术

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Effects of wire deformation behaviour on bondability: Study of Cu wire stitch bonding (2nd Report)

Published:1996-01 Issue:9 Volume:10 Page:711-716
ISSN:0950-7116
Container-title:Welding International
language:en
Short-container-title:Welding International

Author:

Fujimoto K,Nakata S,Masutani Y,Fujii A

Publisher

Informa UK Limited

Subject

Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

http://www.tandfonline.com/doi/pdf/10.1080/09507119609549075

Reference3 articles.

1. Investigation of Cu wire stitch bonding. (Report 1). Influence of bonding condition and surface state on bondability.

2. Takahashi, Inoue and Shibamoto. 1993. ‘Numerical analysis of wire hot‐pressure bonding process and bonding limits viewed from perspective of adhesion mechanism’. Symposium on ‘Ultrafine bonding in microelectronics’. 1993. pp.77–86.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development and Status of Cu Ball/Wedge Bonding in 2012;Journal of Electronic Materials;2013-01-05

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