The use of copper powders recycled from printed wire boards to manufacture a conductive epoxy adhesive
Author:
Publisher
Informa UK Limited
Subject
General Medicine,Environmental Engineering
Link
http://www.tandfonline.com/doi/pdf/10.1080/10934529909376946
Reference26 articles.
1. Kinetic parameters in non-stoichiometric epoxy-resin/m-xylylenediamine reactions
2. Development of an anisotropic conductive adhesive film (ACAF) from epoxy resins
3. Technical Data Sheet,1997
4. Coombs, C. F. 1996.“Printed Circuits Handbook”, 34.3–34.26. New York: McGraw Hill.
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1. Tribological behaviors of graphite/epoxy two-phase composite coatings;Tribology International;2010-08
2. High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer;Journal of Electronic Packaging;2010-03-01
3. Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives;Journal of Electronic Materials;2009-09-24
4. Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging;Journal of Adhesion Science and Technology;2008-01
5. Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives;Journal of Electronic Materials;2007-08-18
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