Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives-Reference-Cited by-同舟云学术

Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

Published:2009-09-24 Issue:1 Volume:39 Page:115-123
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Ho Li-Ngee,Nishikawa Hiroshi,Natsume Naohide,Takemoto Tadashi,Miyake Koichi,Fujita Masakazu,Ota Koyu

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-009-0946-5.pdf

Reference35 articles.

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2. B.T. Alpert and A.J. Schoenberg, Conductive Adhesives as a Soldering Alternative (Oak, Brook, IL: Electronic Packaging and Production, 1991), pp. 130–132.

3. G. Nguyen, J. Williams, F. Gibson, and T. Winster, Proceedings of the International Electronics Packaging Conference (1993), p. 479.

4. J.C. Jagt, IEEE Trans. Compon. Packag. Manuf. Technol. A 21, 215 (1998).

5. M.J. Yim, Y. Li, K.S. Moon, and C.P. Wong, J. Electron. Mater. 36, 1341 (2007).

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