Effect of deposition power and pressure on rate deposition and resistivity of titanium thin films grown by DC magnetron sputtering-Reference-Cited by-同舟云学术

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Effect of deposition power and pressure on rate deposition and resistivity of titanium thin films grown by DC magnetron sputtering

Published:2016-07-22 Issue:8 Volume:49 Page:514-519
ISSN:0038-7010
Container-title:Spectroscopy Letters
language:en
Short-container-title:Spectroscopy Letters

Author:

Wu Shenjiang¹,Chen Hang²,Du Xiaoping³,Liu Zhengjun²

Affiliation:

1. School of Optoelectronics Engineering, Xi'an Technological University, Xi'an, China

2. Department of Automation Measurement and Control, Harbin Institute of Technology, Harbin, China

3. College of Aerospace Equipment, The Academy of Equipment and Technology, Beijing, China

Funder

National Natural Science Foundation of China

the International Science & Technology Cooperation Program of China

Publisher

Informa UK Limited

Subject

Spectroscopy,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/00387010.2016.1212244

Reference24 articles.

1. Micropatterning of nanoenergetic films of Bi2O3/Al for pyrotechnics

2. Characterization of Al/CuO nanoenergetic multilayer films integrated with semiconductor bridge for initiator applications

3. A Micro Fuse Realized by Integrating Al/CuO-Based Nanoenergetic Materials on a Micro Wire

4. A micro initiator realized by integrating KNO3@CNTs nanoenergetic materials with a Cu microbridge

5. Silicon-based bridge wire micro-chip initiators for bismuth oxide–aluminum nanothermite

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3. Effect of sputtering pressure on the electrochromic properties of flexible NiO films prepared by magnetron sputtering;Materials Letters;2024-01

4. Implementing Versatile Programmable Logic Functions Using Two Magnetization Switching Types in a Single Device;Advanced Functional Materials;2023-10-15

5. Adatom controlled emergence of high hardness in biocompatible beta-Ti3Au intermetallic thin film surfaces;Surfaces and Interfaces;2023-08

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