UV-TiO2 photocatalysis-assisted chemical mechanical polishing 4H-SiC wafer
Author:
Affiliation:
1. School of Mechanical Engineering, Shenyang University of Technology, Shenyang, China
2. School of Mechanical Engineering, Northeastern University, Shenyang, China
Funder
National Natural Science Foundation of China
Natural Science Foundation of Liaoning Province of China
China Postdoctoral Science Foundation funded project
Natural Science Foundation of Shenyang City of China
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/10426914.2017.1364855
Reference36 articles.
1. Anisotropy of chemical mechanical polishing in silicon carbide substrates
2. Role of ionic strength in chemical mechanical polishing of silicon carbide using silica slurries
3. Characterization of colloidal silica abrasives with different sizes and their chemical–mechanical polishing performance on 4H-SiC (0001)
4. Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials
5. Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers
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