Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor-Reference-Cited by-同舟云学术

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Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor

Published:2024-03-06 Issue:1 Volume:4 Page:
ISSN:2766-0400
Container-title:Science and Technology of Advanced Materials: Methods
language:en
Short-container-title:Science and Technology of Advanced Materials: Methods

Author:

Zhou Jiaxin¹²^ORCID,Watanabe Ikumu¹²^ORCID,Song Weikang¹²,Kambayashi Keita³^ORCID,Chen Ta-Te²⁴^ORCID

Affiliation:

1. Graduate School of Pure and Applied Sciences, University of Tsukuba, Tsukuba, Japan

2. Center for Basic Research on Materials, National Institute for Materials Science, Tsukuba, Japan

3. Department of Aerospace Engineering, Osaka Metropolitan University, Sakai, Osaka, Japan

4. Graduate School of Engineering, Nagoya University, Nagoya, Japan

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/27660400.2024.2320691

Reference56 articles.

1. Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications

2. Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design

3. Microstructure and compression properties of 3D powder printed Ti-6Al-4V scaffolds with designed porosity: Experimental and computational analysis

4. Mapping porous microstructures to yield desired mechanical properties for application in 3D printed bone scaffolds and orthopaedic implants

5. Empirical formulation of stress concentration factor around an arbitrary-sized spherical dual-cavity system and its application to aluminum die castings

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1. Comparative study of the experimentally observed and GAN-generated 3D microstructures in dual-phase steels;Science and Technology of Advanced Materials;2024-08-15

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