Corrosion insight of iron and bismuth added Sn–1Ag–0.5Cu lead-free solder alloy-Reference-Cited by-同舟云学术

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Corrosion insight of iron and bismuth added Sn–1Ag–0.5Cu lead-free solder alloy

Published:2019-09-30 Issue:1 Volume:55 Page:35-47
ISSN:1478-422X
Container-title:Corrosion Engineering, Science and Technology
language:en
Short-container-title:Corrosion Engineering, Science and Technology

Author:

Subri Nor Wahida Binti¹,Sarraf Masoud¹,Nasiri-Tabrizi Bahman²,Ali Bakhtiar³,Mohd Sabri Mohd Faizul³,Basirun Wan Jeffrey⁴,Sukiman Nazatul Liana¹

Affiliation:

1. Centre of Advanced Materials, Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur, Malaysia

2. School of Biosciences, Faculty of Health and Medical Sciences, Taylor’s University, Selangor, Malaysia

3. Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur, Malaysia

4. Department of Chemistry, Faculty of Science, University of Malaya, Kuala Lumpur, Malaysia

Publisher

Informa UK Limited

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/1478422X.2019.1666458

Reference46 articles.

1. Effect of aluminum addition on the electrochemical corrosion behavior of Sn–3Ag–0.5Cu solder alloy in 3.5 wt% NaCl solution

2. Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution

3. Effects of microstructure and temperature on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder

4. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

5. Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder

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