Cu metallisation on glass substrate with through glass via using wet plating process-Reference-Cited by-同舟云学术

Cu metallisation on glass substrate with through glass via using wet plating process

Published:2021-03-01 Issue:2 Volume:99 Page:87-93
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Takayama M.¹²,Inoue K.¹,Honma H.³,Watanabe M.³

Affiliation:

1. Koto Electric Co., Ltd., Kawaguchi-shi, Japan

2. Graduate School of Engineering, Kanto- Gakuin University, Odawara-shi, Japan

3. Materials & Surface Engineering Research Institute, Kanto-Gakuin University, Odawara-shi, Japan

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/00202967.2021.1877471

Reference13 articles.

1. S. Onitake, K. Inoue, M. Takayama and T. Fujimura: 2017 International Conference on Electronics Packaging (ICEP), 2017, 430–433.

2. Thermal stress reliability of copper through silicon via interconnects for 3D logic devices

3. W. Yoom, Y. Lin and C. Pandi: ICEP 2012, 2012.

4. R. Mahajan, R. Sankman, N. Patel, D.W. Kim, K. Aygum, Z. Qian, Y. Mekonnen, I. Salama, S. Sharan, D. Iyengar and D. Mallik: IEEE Electronic Components and Technology Conf. (ECTC), IEEE 66th, 2016, 557.

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