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Reaction Process of Two-step Catalysation Pre-treatment for Electroless Plating on Non-conducting Substrates

  • Published:2004-01 Issue:3-4 Volume:82 Page:114-117
  • ISSN:0020-2967
  • Container-title:Transactions of the IMF
  • language:en
  • Short-container-title:Transactions of the IMF

Author:

Yamagishi K.,Okamoto N.,Mitsumata N.,Fukumuro N.,Yae S.,Matsuda H.

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference20 articles.

1. M. Paunovic and M. Schlesinger: ‘Fundamentals of electrochemical deposition’, 147; 1998, New York, Wiley.

2. M. Schlesinger and M. Paunovic: ‘Modern electroplating’, 4th edn, 618; 2000, New York, Wiley.

3. W. Riedl: ‘Electroless nickel plating’, 197; 1991, Finishing Publications Ltd.

4. Solution Chemistry and Colloid Formation in the Tin Chloride Sensitizing Process

5. M. Schlesinger: Proc. Symp. Electro-less Deposition of Metal Alloys, 1987; 1988, 93.
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