Contributions of chemical interactions and mechanical interlocking for the adhesion of electroplated copper to ABS in the Cr(VI) etching process
Author:
Funder
Saudi Basic Industries Corporation
King Abdullah University of Science and Technology
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference37 articles.
1. Fundamental aspects of electrometallurgy;Popov,2007
2. Thermoelectric material electroplating: A historical review;Boulanger;J Electron Mater,2010
3. Metallized plastics 1: Fundamental and applied aspects;Mittal,2013
4. Plating on acrylonitrile–butadiene–styrene (ABS) plastic: A review;Olivera;J Mater Sci,2016
5. Electroless nickel plating onto plexiglas® through simple covalent grafting of vinylpyridine seed layer;Vu;Mater Des,2018
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