Microfabrication of conductive copper patterns by meniscus-confined electrodeposition-Reference-Cited by-同舟云学术

Microfabrication of conductive copper patterns by meniscus-confined electrodeposition

Published:2018-06-13 Issue:1 Volume:190 Page:164-172
ISSN:1058-4587
Container-title:Integrated Ferroelectrics
language:en
Short-container-title:Integrated Ferroelectrics

Author:

Lei Yu¹²,Gao Fangpu³,Guo Jianjun²,Xu Gaojie²,Yang Yitao¹

Affiliation:

1. School of Materials Science and Engineering, Shanghai University, Baoshan District, Shanghai, China

2. Zhejiang Key Laboratory of Additive Manufacturing Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China

3. Shandong Energy Zaozhuang Mining Group Xian Coal Ltd, Zaozhuang, China

Funder

Ningbo Science & Technology Bureau

National Natural Science Foundation of China

Publisher

Informa UK Limited

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Ceramics and Composites,Control and Systems Engineering,Electronic, Optical and Magnetic Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/10584587.2018.1457354

Reference25 articles.

1. Fabrication of a thermoelectric generator on a polymer-coated substrate via laser-induced forward transfer of chalcogenide thin films

2. A Simple, Low-Cost Conductive Composite Material for 3D Printing of Electronic Sensors

3. Metal nanoparticle direct inkjet printing for low-temperature 3D micro metal structure fabrication

4. Fabrication of nano-structured gold films by electrohydrodynamic atomisation

5. Multi-nozzle electrohydrodynamic inkjet printing of silver colloidal solution for the fabrication of electrically functional microstructures

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