Analysis of Critical Debonding Pressures of Stressed Thin Films in the Blister Test
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/00218468808071269
Reference15 articles.
1. Measurement of adhesion by a blister method
2. A Blister Test for Adhesion of Polymer Films to SiO2
3. Blow-off pressures for adhering layers
4. The continuum interpretation for fracture and adhesion
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