Parameter estimation in equivalent circuit analysis of dielectric cure monitoring signals using genetic algorithms
Author:
Publisher
Informa UK Limited
Subject
Applied Mathematics,Computer Science Applications,General Engineering
Link
http://www.tandfonline.com/doi/pdf/10.1080/10682760412331313423
Reference36 articles.
1. Dielectric analysis of thermoset cure
2. Modeling the dielectric behavior of epoxy resin blends during curing
3. Dielectric monitoring of epoxy cure
4. Glass fibre epoxy composite cure monitoring using parallel plate dielectric analysis in comparison with thermal and mechanical testing techniques
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3. An Inverse Analysis for Parameter Estimation Applied to a Non-Fourier Conduction–Radiation Problem;Heat Transfer Engineering;2011-05
4. Dielectric monitoring of carbon nanotube network formation in curing thermosetting nanocomposites;Journal of Physics D: Applied Physics;2009-07-06
5. A new tree structure code for equivalent circuit and evolutionary estimation of parameters;Chemometrics and Intelligent Laboratory Systems;2007-01
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