Glass fibre epoxy composite cure monitoring using parallel plate dielectric analysis in comparison with thermal and mechanical testing techniques

Author:

Abraham D.,McIlhagger R.

Publisher

Elsevier BV

Subject

Mechanics of Materials,Ceramics and Composites

Reference26 articles.

1. Cracknell, J. G., McGarel, W., Farnham, H. A., Spratt, G. and Lagan, D., The quality control of composite materials by thermal analysis techniques. In Proceedings of the 9th Conference of the Irish Manufacturing Committee, (IMC-9), Technology in Manufacturing for Europe, University College, Dublin, 1992, pp. 618–627.

2. DSC and TBA studies of the curing behaviour of two dicy-containing epoxy resins;Schneider;Polymer Engineering and Science,1979

3. Cure kinetics of epoxy matrix resin by differential scanning calorimetry;Cizmeciogly;SAMPE Quarterly,1982

4. DSC: A new design for evaluating the thermal behaviour of materials;Mitchell;International Laboratory,1991

5. Gill, P. S., Characterization of polymer composites by thermal analysis. In Proceedings 10th NATAS Conference, 1980, pp. 179–184.

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