An adaptive diagnosis system for copper wire bonding process control and quality assessment in integrated circuit assembly
Author:
Publisher
Informa UK Limited
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanical Engineering,Aerospace Engineering
Link
http://www.tandfonline.com/doi/pdf/10.1080/0951192X.2012.731614
Reference32 articles.
1. An intelligent system approach for surface roughness and vibrations prediction in cylindrical grinding
2. An intuitionistic fuzzy system for time series analysis in plant monitoring and diagnosis
3. Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding
4. Modeling of copper wire bonding process on high power LEDs
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