The Influence of Curing Agent Content on the Mechanical and Adhesive Properties of Dicyandiamide Cured Epoxy Systems-Reference-Cited by-同舟云学术

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The Influence of Curing Agent Content on the Mechanical and Adhesive Properties of Dicyandiamide Cured Epoxy Systems

Published:1995-12 Issue:1-2 Volume:55 Page:31-42
ISSN:0021-8464
Container-title:The Journal of Adhesion
language:en
Short-container-title:The Journal of Adhesion

Author:

Vrana M. A.,Dillard J. G.,Ward T. C.,Rakestraw M. D.,Dillard D. A.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/00218469509342405

Reference22 articles.

1. Dicyandiamide analysis and solubility in epoxy resins

2. Curing of epoxy resins with dicyandiamide and urones

3. Untersuchungen am Reaktionssystem Phenylglycidether-Dicyandiamid/Cyanamid

4. Curing of epoxy resins with dicyandiamide

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Synthesis and characterization of ethylenediamine-modified F-44 phenolic epoxy fiber;International Polymer Processing;2024-04-19

2. Degradation of Epoxy Adhesive containing Dicyandiamide and Carboxyl-Terminated Butadiene Acrylonitrile Rubber due to Water with Open-faced Specimens;The Journal of Adhesion;2020-06-10

3. Occurrence and fate of nitrification and urease inhibitors in the aquatic environment;Environmental Science: Processes & Impacts;2016

4. Mechanical Strength and Tribological Properties of Diglycidyl Ether of Bisphenol-A Cured by Poly(Amide-Amidic Acid) and 4,4’-Diaminodiphenylsulfone;Journal of Macromolecular Science, Part B;2013-11-12

5. Improving adhesive joint design using fracture mechanics;Advances in Structural Adhesive Bonding;2010

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