Author:
Toscano Paul J.,Dettelbacher Claudia,Waechter John,Pavri Neville P.,Hunt Daniel H.,Eisenbraun Eric T.,Zheng Bo,Kaloyeros Alain E.
Subject
Materials Chemistry,Physical and Theoretical Chemistry
Reference51 articles.
1. 1993. Presented in part at the 205th National Meeting. March1993. Denver, CO: American Chemical Society.
2. 1993. “Taken in part from the M.S. thesis of C. Dettelbacher”. State University of New York at Albany.
3. Chemical Vapor Deposition of Metal-Containing Thin-Film Materials from Organometallic Compounds
4. Chemical Vapor Deposition of Copper for Multilevel Metallization
5. Copper metallization for ULSL and beyond
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