An investigation on surface tensions of Pb-free solder materials
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1080/14786435.2016.1217361
Reference70 articles.
1. Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow
2. Lead-free Solders in Microelectronics
3. Improved mechanical properties in new, Pb-free solder alloys
4. Heteroepitaxial diamond growth on platinum(111) by the Shintani process
5. Surface Tension and its Temperature Coefficient of Liquid Sn-X (X=Ag, Cu) Alloys
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3. A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials;Ain Shams Engineering Journal;2022-11
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