On the mechanical response and intermetallic compound formation in Al/Fe interface: molecular dynamics analyses-Reference-Cited by-同舟云学术

On the mechanical response and intermetallic compound formation in Al/Fe interface: molecular dynamics analyses

Published:2020-08-16 Issue:24 Volume:100 Page:3041-3060
ISSN:1478-6435
Container-title:Philosophical Magazine
language:en
Short-container-title:Philosophical Magazine

Author:

El Chlouk Zeina¹,Kassem Wassim²,Shehadeh Mutasem¹,Hamade Ramsey F.¹^ORCID

Affiliation:

1. Department of Mechanical Engineering, American University of Beirut, Beirut, Lebanon

2. Laboratoire d'étude du Comportement Mécanique des Matériaux (LC2M), Service de Recherches Métallurgiques Appliquées, Commissariat d'Energie Atomique (CEA), Gif-sur-Yvette, France

Publisher

Informa UK Limited

Subject

Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/14786435.2020.1804083

Reference47 articles.

1. Molecular dynamics study of growth and interface structure during aluminum deposition on Ni(1 0 0) substrate

2. Molecular dynamics simulation of the deposition and annealing of NiAl film on Ni substrate

3. Molecular-dynamics simulation of the synthesis of intermetallic Ti–Al

4. Molecular dynamics simulation of nano-scale Fe–Al thin film growth

5. Chemical mixing at “Al on Fe” and “Fe on Al” interfaces

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4. Revealing the Epitaxial Interface between Al₁₃Fe₄ and Al₅Fe₂ Enabling Atomic Al Interdiffusion;ACS Applied Materials & Interfaces;2023-04-05

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