Bonding of Dissimilar Metals in the Interlayer Region in Al-Based Composites: Molecular Dynamics

Author:

Polyakova Polina V.1ORCID,Baimova Julia A.12ORCID,Mulyukov Radik R.13ORCID

Affiliation:

1. Institute for Metals Superplasticity Problems of RAS, St. Khalturina 39, 450001 Ufa, Russia

2. Physical-Technical-Physical Institute, Bashkir State University, St. Zaki Validi 32, 450076 Ufa, Russia

3. Department of Mechanical Engineering Technology in the Oil-Gas Field, Ufa State Petroleum Technological University, St. Kosmonavtov 1, 450062 Ufa, Russia

Abstract

The aluminum–matrix composites possess are very important for future applications because they have unique mechanical properties. Here, molecular dynamics is used to analyze the bonding of dissimilar metals on the interface of Al/Mg, Al/Ti, and Al/Cu interfaces during deformation treatment–compression combined with shear at room temperature. The terminal-mechanical treatment used in this simulation is a variant of the experimental technique applied to fabricate Al/Metal composites. It is found that there is a critical value of compressive and shear strain required to obtain the strong mixed Al/Metal interface. The diffusion depth of atoms of both components is dependent on the applied strain: (i) linear relationship for Al/Mg; (ii) logarithmic relationship for Al/Ti and Al/Cu. The mechanical behavior under tension and fracture analysis of the obtained interfaces are discussed in terms of atomic-level structural features which allow an understanding of the interconnection between the mechanical behavior and structure mixture near the interface. One of the important criteria for atomic mixing is the symmetry of the interface. After atomic mixing, Al/Ti composite has the highest ultimate tensile strength, Al/Cu—the average, and Al/Mg—the lowest between the considered interfaces, while the fracture strain of Al/Mg and Al/Ti composites are very close and higher than for Al/Cu. The obtained results are significant for the development of fabrication of Al/Metal interface by high-pressure torsion in practice.

Funder

State Assignment of IMSP RAS

Publisher

MDPI AG

Subject

Physics and Astronomy (miscellaneous),General Mathematics,Chemistry (miscellaneous),Computer Science (miscellaneous)

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