Finite-Volume Method for Creep Analysis of Thin RF MEMS Devices Using the Theory of Plates-Reference-Cited by-同舟云学术

Finite-Volume Method for Creep Analysis of Thin RF MEMS Devices Using the Theory of Plates

Published:2012-02 Issue:2 Volume:61 Page:71-90
ISSN:1040-7790
Container-title:Numerical Heat Transfer, Part B: Fundamentals
language:en
Short-container-title:Numerical Heat Transfer, Part B: Fundamentals

Author:

Das Shankhadeep,Mathur Sanjay R.,Murthy Jayathi Y.

Publisher

Informa UK Limited

Subject

Computer Science Applications,Mechanics of Materials,Condensed Matter Physics,Modelling and Simulation,Numerical Analysis

Link

http://www.tandfonline.com/doi/pdf/10.1080/10407790.2012.646170

Reference48 articles.

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2. J. Y. Park , G. H. Kim , K. W. Chung , and J. U. Bu , Electroplated RF MEMS Capacitive Switches,Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS),Miyazaki, Japan, pp. 639–644, 2000.

3. RF MEMS

4. D. Peroulis , Personal communication , Purdue University , 2010 .

5. Creep as a reliability problem in MEMS

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