DTT functionalization of Ag particles for conducting adhesives-Reference-Cited by-同舟云学术

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DTT functionalization of Ag particles for conducting adhesives

Published:2017-03-10 Issue:6 Volume:94 Page:473-485
ISSN:0021-8464
Container-title:The Journal of Adhesion
language:en
Short-container-title:The Journal of Adhesion

Author:

de Oliveira Cristian S.¹²,Quispe Luis T.¹,Plá Cid Cristiani C.¹,Sierra Jelver A.¹,de Barros Silvio³^ORCID,Mello A.⁴,Pasa André A.¹

Affiliation:

1. Laboratório de Filmes Finos e Superfícies, Departamento de Física, Universidade Federal de Santa Catarina, Florianópolis, SC, Brazil

2. Instituto Federal de Educação, Ciência e Tecnologia do Rio Grande do Sul - Campus Farroupilha, Farroupilha, RS, Brazil

3. Centro Federal de Educação Tecnológica Celso Suckow da Fonseca, Rio de Janeiro, Brazil

4. Centro Brasileiro de Pesquisas Fısicas, Rio de Janeiro, Brazil

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/00218464.2017.1288113

Reference19 articles.

1. Lead (Pb)-free solders for electronic packaging

2. Lead-free Solders in Microelectronics

3. Electrically Conductive Adhesives (ECAs)

4. Lead‐Free Solder Interconnection Reliability20061Dongkai Shangguan. Lead‐Free Solder Interconnection Reliability. ASM International, 12 Chapters, 290 pp. including diagrams and illustrations

5. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrochemical immunoassay of antibodies using freshly prepared and aged conjugates of silver nanoparticles;Talanta;2023-02

2. Electrochemical Immunoassay of Antibodies Using Freshly Prepared and Aged Conjugates of Silver Nanoparticles;SSRN Electronic Journal;2022

3. Effect of Curing Agents on Electrical Properties of Low-Temperature Curing Conductive Coatings and Thermodynamic Analysis;Coatings;2021-05-30

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