Properties of Phenolic-Based Ag-Filled Conductive Adhesive Affected by Different Coupling Agents
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/00218464.2013.775039
Reference38 articles.
1. Study of processing variables on the electrical resistivity of conductive adhesives
2. PROPERTIES OF CONDUCTIVE ADHESIVES BASED ON ANHYDRIDE-CURED EPOXY SYSTEMS
3. Degradation mechanism of ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure
4. Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications
5. Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization
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