1. B.T. Alpert and A.J. Schoenberg, Conductive Adhesives as a Soldering Alternative (Oak, Brook, IL: Electronic Packaging and Production, 1991), pp. 130–132.
2. S.K. Kang, R.S. Rai, and S. Purushothaman, IEEE Trans. Comp. Packaging Manufacturing Technol. Part A, 21, 18 (1998).
3. B. Trumble, IEEE Spectrum 5, 55 (1998).
4. S.K. Kang and A. Sarkel, J. Electron. Mater. 23, 701 (1994).
5. C.P. Wong, K.S. Moon, and Y. Rao (Paper presented at NSF Design, Service, and Manufacturing Grantees and Research Conf., Atlanta, GA, Jan. 2003).