Fabrication and characterisation of polyester/hexagonal boron nitride/sisal fibre hybrid composites for microelectronic applications
Author:
Affiliation:
1. Department of Mechanical Engineering, School of Engineering and Information Technology, MATS University, Raipur, India
2. Department of Mechanical Engineering, Sagar Institute of Research & Technology, Bhopal, India
Funder
Science and Engineering Research Board
Publisher
Informa UK Limited
Subject
Mechanical Engineering
Link
https://www.tandfonline.com/doi/pdf/10.1080/14484846.2023.2236783
Reference45 articles.
1. Influence of particulate surface treatment on physical, mechanical, thermal, and dielectric behavior of epoxy/hexagonal boron nitride composites
2. An experimental investigation of epoxy‐based hybrid composites with hexagonal boron nitride and short sisal fiber as reinforcement for high performance microelectronic applications
3. Investigation of Thermal and Dielectric Properties of Epoxy Based Hybrid Composites for Microelectronics Applications
4. Thermal, mechanical, and dielectric properties of aluminium oxide and solid glass microsphere‐reinforced epoxy composite for electronic packaging application
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1. Exploring the impact of hybridization on green composites: pineapple leaf and sisal fiber reinforcement using poly(furfuryl alcohol) bioresin;Zeitschrift für Physikalische Chemie;2024-04-30
2. Development of hBN/natural fibres reinforced polymer composites using grey relation grade analysis for thermal and electrical applications;Functional Composites and Structures;2024-04-25
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