Laboratory shear bond test for chip-seal under varying environmental and material conditions
Author:
Affiliation:
1. Department of Civil and Environmental Engineering, Michigan Technological University, Houghton, MI, USA
2. School of Forest Resources and Environmental Science, Michigan Technological University, Houghton, MI, USA
Publisher
Informa UK Limited
Subject
Mechanics of Materials,Civil and Structural Engineering
Link
https://www.tandfonline.com/doi/pdf/10.1080/10298436.2019.1662903
Reference40 articles.
1. Construction quality acceptance performance-related specifications for chip seals
2. Effect of aggregate petrology on the durability of asphalt pavements
3. Quantification of Water in Asphalt by Karl Fischer Titration and Its Application to Emulsion Recovery
4. Advanced Testing and Characterization of Interlayer Shear Resistance
5. Durability of asphalt mixtures: Effect of aggregate type and adhesion promoters
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Role of fiber-reinforced chip seal interlayers in asphalt pavement bonding strength;Composite Interfaces;2024-03-18
2. The Role of Reinforced Interface Adhesive Layer to Construct Resilient Pavement;RILEM Bookseries;2024
3. Investigating the deterioration mechanism of adhesion between asphalt and aggregate interface under acid rain erosion;Applied Surface Science;2023-12
4. Mechanical response of interlayer structural shear performance of asphalt pavement with functional layer considering interlayer contact state;Case Studies in Construction Materials;2023-07
5. Comparison of asphalt emulsion-based chip seal and hot rubber asphalt-based chip seal;Case Studies in Construction Materials;2023-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3