METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING
Author:
Publisher
The Electromagnetics Academy
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://www.jpier.org/download/11110503.pdf
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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