ELECTROTHERMAL EFFECTS IN HIGH DENSITY THROUGH SILICON VIA (TSV) ARRAYS
Author:
Publisher
The Electromagnetics Academy
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://www.jpier.org/download/11030503.pdf
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5. Electrothermal Modeling of Carbon Nanotube-Based TSVs;Carbon Nanotubes for Interconnects;2016-07-10
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